Cleanroom
The 950 m2 BRNC external page cleanroom features class 100/1000 facilities including class 10 mini-environments with advanced micro- and nanofabrication capabilities.
Micro- and nanofabrication capabilities:
- Optical contact printers (Frontside/Backside alignment, UV options)
- Laser writer (for masks and direct write, resolution approx. 0.7 micron)
- High-resolution e-beam litho (20 / 50 100 kV)
- Resist processing (coat, bake, develop, strip, ...)
- Thermal probe lithography
- 3D Photolithography
- Nanoimprint lithography
- Maskless Aligner (MLA) direct-write photolithography
- Wafer cleaning (Std. Si cleans, ...)
- Wet etching (Si, III/V, Metals, Oxides/Nitrides, ...)
- Critical point dryer
- 3 Evaporators (e-beam and thermal, for deposition of dielectric and metal layers)
- 2 Sputter Tools (one cluster tool, one single chamber)
- PECVD for Si-oxides, Si-nitrides, a-Si, BPSG, TEOS
- 3 ALD (2 plasma, 1 thermal)
- Ion Beam Deposition (for dielectric mirror stacks and single layers)
- Pulsed Laser Deposition (PLD) for complex oxides and piezoelectric materials
- Thermal Oxidation of Silicon (Wet and dry oxidation)
- LPCVD (Poly-Si, Si-nitride, TEOS)
- 2 Rapid thermal annealers
- 2 RIEs: Fluorine-based chemistry
- 2 ICP-RIEs: Chlorine-based, CH4/H2, HBr
- Ion Milling: non-reactive ion beam etching
- Silicon deep trench etcher: Bosch-Process
- Atomic layer etcher
- XeF2 etcher (anisotropic Si etching)
- HF vapor phase etcher
- Carbon CVD 4inch (CNT and graphene deposition)
- Carbon CVD 6inch (CNT and graphene deposition)
- 2D growth tool (CNT, graphene, h-BN, TMDC)
- Dual beam FIB
- SEM (with EDX)
- AFM
- Ellipsometer (scanning wavelength 190 - 3300 nm)
- Reflectometer
- Raman spectroscopy
- 2 Surface profilers
- White light interferometer
- Wafer probe station (electrical and optical characterization)
- Optical microscopes
- Manual wire bonder
- 2 Flip chip bonders
- Wafer bonder
- Lapping / polishing tool
- CMP
- Electroplating
- Wafer Dicing